Efficient Embedding of Power Semiconductors into PCBs

The SCHWEIZER (smart) p² Pack is a technology for the embedding of power semiconductors into PCBs. This procedure is not simply a new packaging method. More importantly, it allows power electronics systems to be developed in accordance with a completely different philosophy. Applications developed with the smart p² Pack technology enable higher power levels, compact designs, and a high integration depth. The production chain for system suppliers and the lay-up and interconnection technology in the system are greatly simplified as a result. In addition, there are potential cost savings at system level.

Applications
All applications requiring the switching of high powers can benefit from the advantages of the p² Pack. The main application fields lie in conversions between direct current and alternating current systems. Increasingly, these systems face higher power requirements along with expectations of high reliability and a long life. The p² Pack is a key element in achieving this.

Benefits
Reduced thermal resistance
Reduced switching losses due to lower inductance in the system
Reduced conduction losses in static scenarios
Higher power densities possible, so a lower silicon requirement
Significant improvement in product robustness and life

Special Features
Simplified production chain when building systems
None of the yield problems associated with semiconductors
Reduction in system complexity if power and logic have to be distributed over fewer individual components
Fewer components, connections, and predetermined breaking points